Self heating chip test stand

The test bench is equipped with heating elements,sensors,and external temperature control devices, which can heat the chip dring testing and detect the chip parameters under high temperature conditions,saving the cost of the aging furnace. The specific process is that the power supply is connected to the probe through the PCB to supply power to the heating element. The heating element heats the chip through the conductive pressure block, and the temperature is monitored by sensors embedded in the pressure block. The external emperature control box adjusts the power supply and heat dissipation based on the feedback temperature, so that the temperature fluctuates within a narrow range, thus achieving the purpose of high.

BGA芯片测试座.JPG

Popular Product Categories

IC测试座.JPG
芯片老化座.JPG
IMG_3061.JPG
SOT23-5l-0.95老化座.jpg

Buy Now

ATE SOCKET


Buy Now

OPEN TOP SOCKET

Buy Now

QFN SOCKET

Buy Now

DDR SOCKET

Buy Now

Kelvin SOCKET

SOP16(20)-1.27.JPG
QFN52-0.5mm测试座.jpg
10001.jpg
宣传图(3) (1).jpg
SOT23-5l-0.95老化座.jpg

Buy Now

SOP SOCKET

Buy Now

QFN SOCKET

Buy Now

DFN SOCKET

Buy Now

BGA SOCKET

Buy Now

SOT SOCKET

SOT23-5l-0.95烧录座.jpg
3035贴片电容开尔文.JPG
QFP176-0.5mm测试座.png
图1.jpg
微信图片_20250718172910.jpg

Buy Now

SOT SOCKET

Buy Now

SMD SOCKET

Buy Now

QFP SOCKET

Buy Now

EMMC/EMCSP SOCKET

Buy Now

Burn-in socket

WhatsApp
Phone
WeChat